Description

Facilitates a maximum output current level set as -, 32mA. Offers information on high and low output current settings at -, 32mA. The type of logic Buffer, Non-Inverting that guarantees maximum compatibility in electronic design. Mounting configuration Surface Mount for structural stability. Bits per data item 1 for memory or ADC precision. Total elements 2 present in circuits or arrays. Temperature range -40°C ~ 125°C (TA) for environmental conditions impacting thermal efficiency. Type Open Drain for ensuring compatibility with output systems. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 6-XFDFN that offers mechanical and thermal protection. Type of package X2-DFN1409-6 that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component 74LVC. Dimensions of the shell Buffer, Non-Inverting for connectors or enclosures. Supplier package type X2-DFN1409-6 for component selection. Voltage requirement 1.65V ~ 5.5V for electrical specifications. Voltage supply 1.65V ~ 5.5V for device operation.