Attribute
Description
Manufacturer Part Number
CY74FCT163827CPAC
Manufacturer
Description
IC BUFF NON-INVERT 3.6V 56-TSSOP
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 135

Quantity Unit Price Ext. Price
100000 ₹ 61.25000 ₹ 61,25,000.00
10000 ₹ 73.10000 ₹ 7,31,000.00
1000 ₹ 82.00000 ₹ 82,000.00
500 ₹ 88.91000 ₹ 44,455.00
100 ₹ 98.79000 ₹ 9,879.00

Stock:

Distributor: 160


Quantity Unit Price Ext. Price
100000 ₹ 61.25000 ₹ 61,25,000.00
10000 ₹ 73.10000 ₹ 7,31,000.00
1000 ₹ 82.00000 ₹ 82,000.00
500 ₹ 88.91000 ₹ 44,455.00
100 ₹ 98.79000 ₹ 9,879.00

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
100000 ₹ 76.57000 ₹ 76,57,000.00
10000 ₹ 91.39000 ₹ 9,13,900.00
1000 ₹ 102.49000 ₹ 1,02,490.00
500 ₹ 111.14000 ₹ 55,570.00
271 ₹ 123.49000 ₹ 33,465.79

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
216 ₹ 123.65000 ₹ 26,708.40

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Digital Logic Family Buffer, Non-Inverting
Component Element Total 2
Bits per Data Element 10
Entry Signal Category -
Exit Signal Category 3-State
High/Low Logic Current 24mA, 24mA
Power Supply Voltage 2.7V ~ 3.6V
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 56-TFSOP (0.240", 6.10mm Width)
Vendor Package Type 56-TSSOP

Description

Facilitates a maximum output current level set as 24mA, 24mA. Offers information on high and low output current settings at 24mA, 24mA. The type of logic Buffer, Non-Inverting that guarantees maximum compatibility in electronic design. Mounting configuration Surface Mount for structural stability. Bits per data item 10 for memory or ADC precision. Total elements 2 present in circuits or arrays. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type 3-State for ensuring compatibility with output systems. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 56-TFSOP (0.240", 6.10mm Width) that offers mechanical and thermal protection. Type of package 56-TSSOP that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Dimensions of the shell Buffer, Non-Inverting for connectors or enclosures. Supplier package type 56-TSSOP for component selection. Voltage requirement 2.7V ~ 3.6V for electrical specifications. Voltage supply 2.7V ~ 3.6V for device operation.