Attribute
Description
Manufacturer Part Number
CY74FCT16244ATPAC
Manufacturer
Description
IC BUFF NON-INV 5.5V 48-TSSOP II
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 160

Quantity Unit Price Ext. Price
100000 ₹ 27.77000 ₹ 27,77,000.00
10000 ₹ 33.14000 ₹ 3,31,400.00
1000 ₹ 37.18000 ₹ 37,180.00
500 ₹ 40.31000 ₹ 20,155.00
100 ₹ 44.78000 ₹ 4,478.00

Stock:

Distributor: 118


Quantity Unit Price Ext. Price
519 ₹ 30.66000 ₹ 15,912.54
102 ₹ 34.34000 ₹ 3,502.68
1 ₹ 73.59000 ₹ 73.59

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
100000 ₹ 34.71000 ₹ 34,71,000.00
10000 ₹ 41.43000 ₹ 4,14,300.00
1000 ₹ 46.47000 ₹ 46,470.00
663 ₹ 50.38000 ₹ 33,401.94

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
477 ₹ 54.23000 ₹ 25,867.71

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Digital Logic Family Buffer, Non-Inverting
Component Element Total 4
Bits per Data Element 4
Entry Signal Category -
Exit Signal Category 3-State
High/Low Logic Current 32mA, 64mA
Power Supply Voltage 4.5V ~ 5.5V
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 48-TFSOP (0.240", 6.10mm Width)
Vendor Package Type 48-TSSOP II

Description

Facilitates a maximum output current level set as 32mA, 64mA. Offers information on high and low output current settings at 32mA, 64mA. The type of logic Buffer, Non-Inverting that guarantees maximum compatibility in electronic design. Mounting configuration Surface Mount for structural stability. Bits per data item 4 for memory or ADC precision. Total elements 4 present in circuits or arrays. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type 3-State for ensuring compatibility with output systems. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 48-TFSOP (0.240", 6.10mm Width) that offers mechanical and thermal protection. Type of package 48-TSSOP II that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Dimensions of the shell Buffer, Non-Inverting for connectors or enclosures. Supplier package type 48-TSSOP II for component selection. Voltage requirement 4.5V ~ 5.5V for electrical specifications. Voltage supply 4.5V ~ 5.5V for device operation.