Attribute
Description
Manufacturer Part Number
FSA831L10X-F131
Manufacturer
Description
USB2.0 HIGH-SPEED (480MBPS) CHAR
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Primary Function Mode | - | |
| Battery Composition Type | - | |
| Battery Cell Quantity | - | |
| Error Safeguard Features | - | |
| User Interface Type | - | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 10-UFQFN Exposed Pad | |
| Vendor Package Type | 10-MicroPak™ |
Description
Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 10-UFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 10-MicroPak™ that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type 10-MicroPak™ for component selection.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD