Description

Utilizes a SAR architecture to improve effectiveness. Configured in a manner identified as MUX-S/H-ADC. Operates through a data interface specified at SPI. Configured with Single Ended input type for diverse applications. Mounting configuration Surface Mount for structural stability. Number of A/D converters 1 for transforming analog signals into digital. Overall bits 12 ensuring digital precision. The total number of converters is 1 for power or signal transformation. Overall inputs 8 for sensors or equipment. Temperature range -40°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 16-TSSOP (0.173", 4.40mm Width) that offers mechanical and thermal protection. Type of package 16-TSSOP that preserves the integrity of the device. Product status Last Time Buy concerning availability and lifecycle. Sample/hold to ADC ratio 1:1 for precise circuits. Signal capture rate of 1M. Supplier package type 16-TSSOP for component selection. Voltage supply 2.7V ~ 3.6V for the analog section of circuits. Voltage supplied to digital components 2.7V ~ 3.6V.