Description

Utilizes a Pipelined architecture to improve effectiveness. Configured in a manner identified as S/H-ADC. Operates through a data interface specified at Parallel. Equipped with features categorized as Simultaneous Sampling. Configured with Differential input type for diverse applications. Mounting configuration Surface Mount for structural stability. Number of A/D converters 2 for transforming analog signals into digital. Overall bits 14 ensuring digital precision. The total number of converters is 2 for power or signal transformation. Overall inputs 2 for sensors or equipment. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 64-VFQFN Exposed Pad, CSP that offers mechanical and thermal protection. Type of package 64-LFCSP-VQ (9x9) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Sample/hold to ADC ratio 1:1 for precise circuits. Kind of reference External, Internal utilized for component identification. Signal capture rate of 40M. Supplier package type 64-LFCSP-VQ (9x9) for component selection. Voltage supply 1.7V ~ 1.9V for the analog section of circuits. Voltage supplied to digital components 1.7V ~ 3.6V.