Description

Delivers a -3dB bandwidth of 50MHz to maintain reliable signal quality. Offers off-state channel capacitance of 30pF. Ensures ΔRon alignment accuracy defined at 10mOhm. Provides charge injection capability rated at 162pC. Minimizes crosstalk with a level of -67dB @ 1MHz for improved signal quality. Highlights the maximum off-state leakage (IS(off)) rated at 30nA. Mounting configuration Surface Mount for structural stability. Mux/demux pathway 2:1 for signal control. The total number of circuits stands at 1 for electrical or electronic setups. Resistance during the on-state 500mOhm for effective conduction. Peak resistance in the on-state 500mOhm for electrical efficiency. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 8-UFBGA, FCBGA that offers mechanical and thermal protection. Type of package 8-FlipChip that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Supplier package type 8-FlipChip for component selection. Circuit switch SPDT for functional operations. Maximum on/off switching duration Ton/Toff 38ns, 38ns for timing accuracy. Single voltage supply for electronic devices at V+ 1.65V ~ 4.8V.