Description

Delivers a -3dB bandwidth of 800MHz to maintain reliable signal quality. Offers off-state channel capacitance of 2pF. Ensures ΔRon alignment accuracy defined at 300mOhm. Provides charge injection capability rated at 6.4pC. Minimizes crosstalk with a level of -78dB @ 1MHz for improved signal quality. Highlights the maximum off-state leakage (IS(off)) rated at 20nA. Mounting configuration Surface Mount for structural stability. Mux/demux pathway 2:2 for signal control. The total number of circuits stands at 4 for electrical or electronic setups. Resistance during the on-state 5.8Ohm for effective conduction. Peak resistance in the on-state 5.8Ohm for electrical efficiency. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 30-WFBGA, FCBGA that offers mechanical and thermal protection. Type of package FlipChip 30 that preserves the integrity of the device. Product status Last Time Buy concerning availability and lifecycle. Supplier package type FlipChip 30 for component selection. Circuit switch DPDT for functional operations. Maximum on/off switching duration Ton/Toff 15ns, 13ns for timing accuracy. Single voltage supply for electronic devices at V+ 1.65V ~ 4.3V.