Attribute
Description
Manufacturer Part Number
SIM3U166-B-GM
Description
IC MCU 32BIT 256KB FLASH 64QFN
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 117

Quantity Unit Price Ext. Price
520 ₹ 1,119.36000 ₹ 5,82,067.20
260 ₹ 1,151.78000 ₹ 2,99,462.80
100 ₹ 1,207.28000 ₹ 1,20,728.00
25 ₹ 1,313.94000 ₹ 32,848.50
10 ₹ 1,403.26000 ₹ 14,032.60
1 ₹ 1,689.37000 ₹ 1,689.37

Stock:

Distributor: 148


Quantity Unit Price Ext. Price
1 ₹ 1,142.76000 ₹ 1,142.76

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line SiM3U1xx
IC Encapsulation Type Tray
Availability Status Not For New Designs
Central CPU Unit ARM® Cortex®-M3
Processor Core Dimensions 32-Bit
Operational Speed Rating 80MHz
Interconnect Options EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART, USB
External Device Support Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Input/Output Port Count 50
Firmware Storage Capacity 256KB (256K x 8)
Code Storage Technology FLASH
Non-Volatile Memory Capacity -
Random Access Memory Bytes 32K x 8
Core Supply Voltage 1.8V ~ 3.6V
Analog-Digital Transformers A/D 28x12b; D/A 2x10b
Frequency Generator Category Internal
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Vendor Package Type 64-QFN (9x9)
Component Housing Style 64-VFQFN Exposed Pad

Description

Presents connection choices defined by EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 28x12b; D/A 2x10b. Mounting configuration Surface Mount for structural stability. Overall I/O 50 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 64-VFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 64-QFN (9x9) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT for system integration and improvement. Product status Not For New Designs concerning availability and lifecycle. Firmware storage size 256KB (256K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 32K x 8 for system or device specifications. Classification series for the product or component SiM3U1xx. Operational speed 80MHz for mechanical or data tasks. Supplier package type 64-QFN (9x9) for component selection. Voltage requirement 1.8V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.8V ~ 3.6V for electronic devices.