Description

Presents connection choices defined by EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as ARM926EJ-S for swift processing. Designed with core dimensions specified as 16/32-Bit. Comprises data converters classified as A/D 4x10b. Mounting configuration Surface Mount for structural stability. Overall I/O 20 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator External for generating frequency. Type of housing TrayTray for safeguarding or transporting components. Style of the enclosure/case 180-TFBGA that offers mechanical and thermal protection. Type of package 180-TFBGA (12x12) that preserves the integrity of the device. Support for external devices DMA, I2S, LCD, PWM, WDT for system integration and improvement. Product status Obsolete concerning availability and lifecycle. Storage medium ROMless for program retention. The total size of RAM 192K x 8 for system or device specifications. Classification series for the product or component LPC3100. Operational speed 270MHz for mechanical or data tasks. Supplier package type 180-TFBGA (12x12) for component selection. Voltage requirement 1.1V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.1V ~ 3.6V for electronic devices.