Description

Presents connection choices defined by EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG for seamless integration. Includes the core processor identified as ARM7® for swift processing. Designed with core dimensions specified as 16/32-Bit. Comprises data converters classified as A/D 8x10b; D/A 1x10b. Mounting configuration Surface Mount for structural stability. Overall I/O 160 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 208-TFBGA that offers mechanical and thermal protection. Type of package 208-TFBGA (15x15) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT for system integration and improvement. Product status Not For New Designs concerning availability and lifecycle. Storage medium ROMless for program retention. The total size of RAM 82K x 8 for system or device specifications. Classification series for the product or component LPC2400. Operational speed 72MHz for mechanical or data tasks. Supplier package type 208-TFBGA (15x15) for component selection. Voltage requirement 3V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 3V ~ 3.6V for electronic devices.