Description

Presents connection choices defined by CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB for seamless integration. Includes the core processor identified as ARM7® for swift processing. Designed with core dimensions specified as 16/32-Bit. Comprises data converters classified as A/D 6x10b; D/A 1x10b. Mounting configuration Surface Mount for structural stability. Overall I/O 70 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 100-TFBGA that offers mechanical and thermal protection. Type of package 100-TFBGA (9x9) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT for system integration and improvement. Product status Not For New Designs concerning availability and lifecycle. Firmware storage size 512KB (512K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 58K x 8 for system or device specifications. Classification series for the product or component LPC2300. Operational speed 72MHz for mechanical or data tasks. Supplier package type 100-TFBGA (9x9) for component selection. Voltage requirement 3V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 3V ~ 3.6V for electronic devices.