Description

Presents connection choices defined by CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 8x12b; D/A 1x10b. Represents EEPROM capacity measured at 4K x 8. Mounting configuration Surface Mount for structural stability. Overall I/O 141 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 180-TFBGA that offers mechanical and thermal protection. Type of package 180-TFBGA (12x12) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 256KB (256K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 80K x 8 for system or device specifications. Classification series for the product or component LPC17xx. Operational speed 120MHz for mechanical or data tasks. Supplier package type 180-TFBGA (12x12) for component selection. Voltage requirement 2.4V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2.4V ~ 3.6V for electronic devices.