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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Central CPU Unit | ARM9 | |
| Processor Core Dimensions | 32-Bit | |
| Operational Speed Rating | 200MHz | |
| Interconnect Options | EBI/EMI, IrDA, Microwire, Memory Card, PS/2, Smart | |
| Random Access Memory Bytes | 64 | |
| Input/Output Port Count | - | |
| Firmware Storage Capacity | ROMless | |
| Code Storage Technology | - | |
| Non-Volatile Memory Capacity | 80K x 8 | |
| Core Supply Voltage | 1.71 V ~ 3.6 V | |
| Analog-Digital Transformers | A/D 9x10b | |
| Frequency Generator Category | External | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Component Housing Style | 324-LFBGA |
Description
Assesses resistance at forward current ROMless for LED or diode testing. Presents connection choices defined by EBI/EMI, IrDA, Microwire, Memory Card, PS/2, Smart for seamless integration. Includes the core processor identified as ARM9 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 9x10b. Represents EEPROM capacity measured at 80K x 8. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of generator External for generating frequency. Style of the enclosure/case 324-LFBGA that offers mechanical and thermal protection. Firmware storage size ROMless for memory capacity. The total size of RAM 64 for system or device specifications. Operational speed 200MHz for mechanical or data tasks. Voltage requirement 1.71 V ~ 3.6 V for electrical specifications. Vcc/Vdd voltage supply 1.71 V ~ 3.6 V for electronic devices.
