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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Central CPU Unit | HCS12 | |
| Processor Core Dimensions | 16-Bit | |
| Operational Speed Rating | 25MHz | |
| Interconnect Options | CAN, EBI/EMI, SCI, SPI | |
| Random Access Memory Bytes | 35 | |
| Input/Output Port Count | 64KB (64K x 8) | |
| Firmware Storage Capacity | FLASH | |
| Code Storage Technology | - | |
| Non-Volatile Memory Capacity | 4K x 8 | |
| Core Supply Voltage | 2.35 V ~ 5.5 V | |
| Analog-Digital Transformers | A/D 8x10b | |
| Frequency Generator Category | Internal | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Component Housing Style | 52-LQFP |
Description
Assesses resistance at forward current FLASH for LED or diode testing. Presents connection choices defined by CAN, EBI/EMI, SCI, SPI for seamless integration. Includes the core processor identified as HCS12 for swift processing. Designed with core dimensions specified as 16-Bit. Comprises data converters classified as A/D 8x10b. Represents EEPROM capacity measured at 4K x 8. Overall I/O 64KB (64K x 8) for electronic connections. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Style of the enclosure/case 52-LQFP that offers mechanical and thermal protection. Firmware storage size FLASH for memory capacity. The total size of RAM 35 for system or device specifications. Operational speed 25MHz for mechanical or data tasks. Voltage requirement 2.35 V ~ 5.5 V for electrical specifications. Vcc/Vdd voltage supply 2.35 V ~ 5.5 V for electronic devices.
