Description

Presents connection choices defined by I2C, SPI, UART/USART for seamless integration. Includes the core processor identified as 8052 for swift processing. Designed with core dimensions specified as 8-Bit. Comprises data converters classified as A/D 6x12b; D/A 2x12b. Represents EEPROM capacity measured at 640 x 8. Mounting configuration Surface Mount for structural stability. Overall I/O 17 for electronic connections. Temperature range -40°C ~ 125°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 28-TSSOP (0.173", 4.40mm Width) that offers mechanical and thermal protection. Type of package 28-TSSOP that preserves the integrity of the device. Support for external devices POR, PSM, Temp Sensor, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 8KB (8K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 256 x 8 for system or device specifications. Classification series for the product or component MicroConverter® ADuC8xx. Operational speed 16.78MHz for mechanical or data tasks. Supplier package type 28-TSSOP for component selection. Voltage requirement 2.7V ~ 5.5V for electrical specifications. Vcc/Vdd voltage supply 2.7V ~ 5.5V for electronic devices.