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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | eGaN® | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | Power Management | |
| Primary Function Mode | * | |
| Integrated Embedded System | - | |
| Core Integrated Circuit | EPC2015, EPC2023 | |
| Key Feature Specifications | - | |
| Additional Feature Specs | - | |
| Included Components | Board(s) |
Description
Contains internal parts categorized as Board(s). Engineered with * features for versatile component usage. Type of housing Bulk for safeguarding or transporting components. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component eGaN®. Type classification Power Management for specifications. IC or component EPC2015, EPC2023 utilized in circuit design.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD