Home Products Mcu Fpga Development Boards And Kits Daughter Card Expansions Sciosense Gp30ya F01 St Ns V1 0
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Supported Hardware Platform | Nucleo | |
| Device Type Classification | Sensor | |
| Primary Function Mode | Light, 3D Time-of-Flight (ToF) | |
| Core Integrated Circuit | TDC-GP30YA-F01 | |
| Included Components | Board(s) |
Description
Contains internal parts categorized as Board(s). Engineered with Light, 3D Time-of-Flight (ToF) features for versatile component usage. Type of housing Bulk for safeguarding or transporting components. The platform Nucleo for the integration of hardware systems. Product status Active concerning availability and lifecycle. Type classification Sensor for specifications. IC or component TDC-GP30YA-F01 utilized in circuit design.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD