Attribute
Description
Manufacturer Part Number
OSDZU3-REF
Manufacturer
Description
EVAL BOARD FOR OSDZU3
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Zynq® UltraScale+™ | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Device Type Classification | FPGA + MCU/MPU SoC | |
| Supported Hardware Platform | - | |
| Included Components | Board(s) | |
| Core Integrated Circuit | OSDZU3, XCZU3EG |
Description
Contains internal parts categorized as Board(s). Type of housing Box for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component Zynq® UltraScale+™. Type classification FPGA + MCU/MPU SoC for specifications. IC or component OSDZU3, XCZU3EG utilized in circuit design.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD