Attribute
Description
Manufacturer Part Number
MIKROE-303
Manufacturer
Description
TSSOP-SSOP-8 TO DIP8-300MIL ADAP
Manufacturer Lead Time
5 weeks
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | SSOP, TSSOP | |
| Switch Position Options | 8 | |
| Component Spacing Distance | 0.026" (0.65mm) | |
| Circuit Board Depth | - | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | - |
Description
Type of construction material FR4 Epoxy Glass for durability and efficiency. Overall number of positions 8 for switches or mechanical components. Type of housing Box for safeguarding or transporting components. Accepted package formats SSOP, TSSOP for manufacturing or assembly. Distance 0.026" (0.65mm) for arranging components or aligning connectors. Product status Active concerning availability and lifecycle. Design of prototype board SMD to DIP for development tasks.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD