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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Proto-Advantage | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Prototype Board Style | SMD to DIP | |
| Supported Package Formats | SOIC | |
| Switch Position Options | 16 | |
| Component Spacing Distance | 0.050" (1.27mm) | |
| Circuit Board Depth | 0.062" (1.57mm) 1/16" | |
| Construction Material Type | FR4 Epoxy Glass | |
| Package Size Specs | 0.700" x 0.800" (17.78mm x 20.32mm) |
Description
Features a thickness of 0.062" (1.57mm) 1/16" to ensure strong structural integrity. Type of construction material FR4 Epoxy Glass for durability and efficiency. Overall number of positions 16 for switches or mechanical components. Type of housing Bulk for safeguarding or transporting components. Accepted package formats SOIC for manufacturing or assembly. Distance 0.050" (1.27mm) for arranging components or aligning connectors. Product status Active concerning availability and lifecycle. Design of prototype board SMD to DIP for development tasks. Classification series for the product or component Proto-Advantage. Details on package size 0.700" x 0.800" (17.78mm x 20.32mm) for electrical or mechanical components. Measurement dimensions 0.700" x 0.800" (17.78mm x 20.32mm) for component specifications.
