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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Intended Usage Scenario | - | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | Square | |
| Dimensional Outline Drawing | 150.00mm x 150.00mm | |
| Material Thickness Gauge | 0.0390" (0.991mm) | |
| Construction Material Type | Silicone | |
| Bonding Agent Type | Adhesive - Both Sides | |
| Support Layer Material | Polyethylene-Terephthalate (PET) | |
| Visual Hue | Black-Gray | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 7.2W/m-K |
Description
Applies Adhesive - Both Sides adhesive for strong and lasting bonding. Constructed with Polyethylene-Terephthalate (PET) backing/carrier materials for durability. Offered in a shade referred to as Black-Gray to enhance the system's aesthetics. Type of construction material Silicone for durability and efficiency. Shape outline 150.00mm x 150.00mm for device design and footprint. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Shape Square for the part or device. Thermal conductivity coefficient 7.2W/m-K for effective heat transfer. Measurement of thickness 0.0390" (0.991mm) for material or component dimensions. Type classification Gap Filler Pad, Sheet for specifications.
