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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Core Technology Platform | Piezo | |
| Device Type Classification | General Purpose | |
| Operational Hz Spectrum | 500 Hz ~ 10 kHz | |
| Self-Resonance Frequency | 1050Hz | |
| AC Resistance Value | - | |
| Noise Efficiency in dBA | 76.00 | |
| Tested Efficiency Metrics | - | |
| Efficiency Measurement Method | Sound Pressure Level (SPL) | |
| Nominal Power Rating | - | |
| Maximum Power Handling | - | |
| Connection Port Placement | Top | |
| Physical Shape Form | Round | |
| Speaker Cone Material | - | |
| Magnetic Element Composition | - | |
| Dust Water Resistance Rating | - | |
| Performance Rating Specs | - | |
| Circuit End Method | Solder Pads | |
| Package Size Specs | 1.114" L x 0.906" W (28.30mm x 23.00mm) | |
| Maximum Mounted Height | 0.035" (0.90mm) |
Description
Shows the type of efficiency identified as Sound Pressure Level (SPL). Records efficiency measured at 76.00 dBA. Features a 1050Hz self-resonant frequency that enhances component efficiency. Offers a 500 Hz ~ 10 kHz frequency spectrum for broad-spectrum applications. Maximum installed height of 0.035" (0.90mm) for components affixed to the board. Type of housing Tray for safeguarding or transporting components. The Top position of the port for installation reference. Product status Obsolete concerning availability and lifecycle. Shape Round for the part or device. Details on package size 1.114" L x 0.906" W (28.30mm x 23.00mm) for electrical or mechanical components. Measurement dimensions 1.114" L x 0.906" W (28.30mm x 23.00mm) for component specifications. The primary technology platform Piezo linked to the product category. Termination method Solder Pads for electrical or mechanical connections. Type classification General Purpose for specifications.
