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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | EAS | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Core Technology Platform | Magnetic | |
| Device Type Classification | Full Range | |
| Operational Hz Spectrum | - | |
| Self-Resonance Frequency | - | |
| AC Resistance Value | 8 Ohms | |
| Noise Efficiency in dBA | 92.00 | |
| Tested Efficiency Metrics | 1W/500mm | |
| Efficiency Measurement Method | Sound Pressure Level (SPL) | |
| Nominal Power Rating | 500 mW | |
| Maximum Power Handling | - | |
| Connection Port Placement | - | |
| Physical Shape Form | Round | |
| Speaker Cone Material | - | |
| Magnetic Element Composition | - | |
| Dust Water Resistance Rating | - | |
| Performance Rating Specs | - | |
| Circuit End Method | Solder Eyelet(s) | |
| Package Size Specs | 2.244" Dia (57.00mm) | |
| Maximum Mounted Height | 0.807" (20.50mm) |
Description
Includes efficiency metrics assessed at 1W/500mm. Shows the type of efficiency identified as Sound Pressure Level (SPL). Records efficiency measured at 92.00 dBA. Maximum installed height of 0.807" (20.50mm) for components affixed to the board. Configured with 8 Ohms impedance to maintain signal quality. Type of housing Bulk for safeguarding or transporting components. Energy requirement 500 mW for device functionality. Designated power 500 mW to meet compliance standards. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component EAS. Shape Round for the part or device. Details on package size 2.244" Dia (57.00mm) for electrical or mechanical components. Measurement dimensions 2.244" Dia (57.00mm) for component specifications. The primary technology platform Magnetic linked to the product category. Termination method Solder Eyelet(s) for electrical or mechanical connections. Type classification Full Range for specifications.
