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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Device Type Classification | Ceramic | |
| Peak Voltage Tolerance | 20V | |
| Maximum Holding Current | 2.1 A | |
| Trip Threshold Current | 4.15 A | |
| Maximum Amp Rating | 10 A | |
| Fault Trip Duration | - | |
| Minimum Initial Resistance | - | |
| Max Post-Trip Resistance | - | |
| Typical Resistance at 25C | 300 mOhms | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Performance Rating Specs | - | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | Radial, Disc | |
| Package Size Specs | 0.866" Dia x 0.138" T (22.00mm x 3.50mm) | |
| Maximum Mounted Height | 1.004" (25.50mm) | |
| Maximum Thickness Limit | - | |
| Pin Lead Gap | 0.197" (5.00mm) |
Description
Indicates the maximum holding current recorded at 2.1 A. Indicates the maximum allowable current rating at 10 A. Delivers trip current recorded at 4.15 A. Maximum installed height of 1.004" (25.50mm) for components affixed to the board. Lead spacing 0.197" (5.00mm) to meet PCB design requirements. Mounting configuration Through Hole for structural stability. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case Radial, Disc that offers mechanical and thermal protection. Product status Obsolete concerning availability and lifecycle. Normal resistance at 25°C 300 mOhms for reference. Details on package size 0.866" Dia x 0.138" T (22.00mm x 3.50mm) for electrical or mechanical components. Measurement dimensions 0.866" Dia x 0.138" T (22.00mm x 3.50mm) for component specifications. Type classification Ceramic for specifications. The maximum voltage 20V specified by the device.
