Attribute
Description
Manufacturer Part Number
OM13497UL
Manufacturer
Description
SURFACE MOUNT TO DIP EVALUATION
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Not For New Designs | |
| Assembly Kit Category | Adapter, Breakout Boards | |
| Item Quantity Available | 18 Pieces (3 Values - 6 Each) | |
| Supported Package Formats | HTSSOP, VFBGA, XFBGA | |
| Technical Specifications | SMD to DIP | |
| Switch Position Options | 24 |
Description
Offers Adapter, Breakout Boards kit type tailored for its intended application. Overall number of positions 24 for switches or mechanical components. Type of housing Bulk for safeguarding or transporting components. Accepted package formats HTSSOP, VFBGA, XFBGA for manufacturing or assembly. Product status Not For New Designs concerning availability and lifecycle. Quantity in stock 18 Pieces (3 Values - 6 Each) for order fulfillment or inventory control. Information SMD to DIP for detailed product data.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD