Attribute
Description
Manufacturer Part Number
OM13496UL
Manufacturer
Description
SURFACE MOUNT TO DIP EVALUATION
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Not For New Designs
Assembly Kit Category Adapter, Breakout Boards
Item Quantity Available 23 Pieces (4 Values - Mixed Quantities)
Supported Package Formats QSOP, TSSOP28, XFBGA, XQFN
Technical Specifications SMD to DIP
Switch Position Options 16, 28

Description

Offers Adapter, Breakout Boards kit type tailored for its intended application. Overall number of positions 16, 28 for switches or mechanical components. Type of housing Bulk for safeguarding or transporting components. Accepted package formats QSOP, TSSOP28, XFBGA, XQFN for manufacturing or assembly. Product status Not For New Designs concerning availability and lifecycle. Quantity in stock 23 Pieces (4 Values - Mixed Quantities) for order fulfillment or inventory control. Information SMD to DIP for detailed product data.