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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | europacPRO | |
| IC Encapsulation Type | Box | |
| Availability Status | Active | |
| Device Type Classification | Subrack Kit | |
| Package Size Specs | 11.614" L x 16.800" W (295.00mm x 426.72mm) | |
| Vertical Dimension | 6U = 10.500" (266.70mm) | |
| Memory Card Dimension Limits | - | |
| Alignment Guide Technique | No Card Guide | |
| Construction Material Type | Aluminum |
Description
Utilizes No Card Guide guiding method for accurate alignment and positioning. Features a height of 6U = 10.500" (266.70mm) for accurate dimensional precision. Type of construction material Aluminum for durability and efficiency. Type of housing Box for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component europacPRO. Details on package size 11.614" L x 16.800" W (295.00mm x 426.72mm) for electrical or mechanical components. Measurement dimensions 11.614" L x 16.800" W (295.00mm x 426.72mm) for component specifications. Type classification Subrack Kit for specifications.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD