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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | OM-CP-ProcessX | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Packaging Vessel Style | Enclosure | |
| Package Size Specs | 4.000" L x 3.630" W (101.60mm x 92.20mm) | |
| Vertical Dimension | 6.750" (171.45mm) | |
| Surface Dimensions Length x Width | 14.5in² (94cm²) | |
| Engineering Layout | Cover Included, Perforated | |
| Construction Material Type | Metal, Stainless Steel | |
| Visual Hue | Gray | |
| Material Thickness Gauge | - | |
| Key Product Highlights | - | |
| Performance Rating Specs | IP66, NEMA 1,2,3,4,4X,12,13 | |
| Fire Resistance Classification | - |
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD