Attribute
Description
Manufacturer Part Number
CSD75204W15
Manufacturer
Description
MOSFET 2P-CH 3A 9DSBGA
Manufacturer Lead Time
53 weeks
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Stock:

Distributor: 160

Quantity Unit Price Ext. Price
100000 ₹ 23.39000 ₹ 23,39,000.00
10000 ₹ 27.91000 ₹ 2,79,100.00
1000 ₹ 31.31000 ₹ 31,310.00
500 ₹ 33.94000 ₹ 16,970.00
100 ₹ 37.72000 ₹ 3,772.00

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
100000 ₹ 29.24000 ₹ 29,24,000.00
10000 ₹ 34.89000 ₹ 3,48,900.00
1000 ₹ 39.14000 ₹ 39,140.00
787 ₹ 42.44000 ₹ 33,400.28

Stock:

Distributor: 121


Quantity Unit Price Ext. Price
1 ₹ 38.68000 ₹ 38.68

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line NexFET™
IC Encapsulation Type Tape & Reel (TR)Bulk
Availability Status Obsolete
Core Technology Platform MOSFET (Metal Oxide)
Setup Arrangement 2 P-Channel (Dual)
Transistor Special Function Logic Level Gate
Drain-Source Breakdown Volts -
Continuous Drain Current at 25C 3A
Max On-State Resistance -
Max Threshold Gate Voltage 900mV @ 250µA
Max Gate Charge at Vgs 3.9nC @ 4.5V
Max Input Cap at Vds 410pF @ 10V
Maximum Power Handling 700mW
Ambient Temp Range -55°C ~ 150°C (TJ)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 9-UFBGA, DSBGA
Vendor Package Type 9-DSBGA

Description

Configured in a manner identified as 2 P-Channel (Dual). Is capable of sustaining a continuous drain current (Id) of 3A at 25°C. Offers FET traits classified as Logic Level Gate. Ensures maximum 3.9nC @ 4.5V gate charge at Vgs for improved switching efficiency. Maintains 3.9nC @ 4.5V gate charge at Vgs for dependable MOSFET operation. The maximum input capacitance reaches 410pF @ 10V at Vds to protect the device. The input capacitance is specified at 410pF @ 10V at Vds for peak performance. Mounting configuration Surface Mount for structural stability. Temperature range -55°C ~ 150°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Bulk for safeguarding or transporting components. Style of the enclosure/case 9-UFBGA, DSBGA that offers mechanical and thermal protection. Type of package 9-DSBGA that preserves the integrity of the device. Maximum power capability 700mW for safeguarding the device. Product status Obsolete concerning availability and lifecycle. Maximum Rds(on) at Id 3.9nC @ 4.5V for MOSFET performance. Classification series for the product or component NexFET™. Supplier package type 9-DSBGA for component selection. The primary technology platform MOSFET (Metal Oxide) linked to the product category. Maximum Vgs(th) at Id 900mV @ 250µA for MOSFET threshold specifications.