Attribute
Description
Manufacturer Part Number
BSM300D12P3E005
Manufacturer
Description
MOSFET 2N-CH 1200V 300A MODULE
Manufacturer Lead Time
18 weeks
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Stock:

Distributor: 128

Quantity Unit Price Ext. Price
40 ₹ 70,031.24000 ₹ 28,01,249.60
4 ₹ 84,074.18000 ₹ 3,36,296.72
1 ₹ 84,412.50000 ₹ 84,412.50

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 1,22,049.26000 ₹ 1,22,049.26

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
1 ₹ 1,22,057.27000 ₹ 1,22,057.27

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
1 ₹ 1,29,783.80000 ₹ 1,29,783.80

Stock:

Distributor: 130


Quantity Unit Price Ext. Price
1 ₹ 1,40,699.56000 ₹ 1,40,699.56

Stock:

Distributor: 118


Quantity Unit Price Ext. Price
4 ₹ 1,76,220.00000 ₹ 7,04,880.00
3 ₹ 1,93,842.00000 ₹ 5,81,526.00
1 ₹ 1,99,716.00000 ₹ 1,99,716.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Obsolete
Core Technology Platform Silicon Carbide (SiC)
Setup Arrangement 2 N-Channel (Half Bridge)
Transistor Special Function -
Drain-Source Breakdown Volts 1200V (1.2kV)
Continuous Drain Current at 25C 300A (Tc)
Max On-State Resistance -
Max Threshold Gate Voltage 5.6V @ 91mA
Max Gate Charge at Vgs -
Max Input Cap at Vds 14000pF @ 10V
Maximum Power Handling 1260W (Tc)
Ambient Temp Range -40°C ~ 150°C (TJ)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Chassis Mount
Component Housing Style Module
Vendor Package Type Module

Description

Configured in a manner identified as 2 N-Channel (Half Bridge). Is capable of sustaining a continuous drain current (Id) of 300A (Tc) at 25°C. Supports a Vdss drain-to-source voltage rated at 1200V (1.2kV). The maximum input capacitance reaches 14000pF @ 10V at Vds to protect the device. The input capacitance is specified at 14000pF @ 10V at Vds for peak performance. Mounting configuration Chassis Mount for structural stability. Temperature range -40°C ~ 150°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case Module that offers mechanical and thermal protection. Type of package Module that preserves the integrity of the device. Maximum power capability 1260W (Tc) for safeguarding the device. Product status Obsolete concerning availability and lifecycle. Supplier package type Module for component selection. The primary technology platform Silicon Carbide (SiC) linked to the product category. Maximum Vgs(th) at Id 5.6V @ 91mA for MOSFET threshold specifications.