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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tape & Reel (TR)Cut Tape (CT)Digi-Reel® | |
| Availability Status | Active | |
| Core Technology Platform | GaNFET (Gallium Nitride) | |
| Setup Arrangement | 2 N-Channel (Dual) Common Source | |
| Transistor Special Function | - | |
| Drain-Source Breakdown Volts | 100V | |
| Continuous Drain Current at 25C | 5A | |
| Max On-State Resistance | - | |
| Max Threshold Gate Voltage | - | |
| Max Gate Charge at Vgs | - | |
| Max Input Cap at Vds | - | |
| Maximum Power Handling | - | |
| Ambient Temp Range | 150°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | Die | |
| Vendor Package Type | Die |
Description
Configured in a manner identified as 2 N-Channel (Dual) Common Source. Is capable of sustaining a continuous drain current (Id) of 5A at 25°C. Supports a Vdss drain-to-source voltage rated at 100V. Mounting configuration Surface Mount for structural stability. Temperature range 150°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case Die that offers mechanical and thermal protection. Type of package Die that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type Die for component selection. The primary technology platform GaNFET (Gallium Nitride) linked to the product category.
