Attribute
Description
Manufacturer Part Number
EPC2107
Manufacturer
Description
MOSFET 3N-CH 100V 9BGA
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line eGaN®
IC Encapsulation Type Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Availability Status Last Time Buy
Core Technology Platform GaNFET (Gallium Nitride)
Setup Arrangement 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Transistor Special Function -
Drain-Source Breakdown Volts 100V
Continuous Drain Current at 25C 1.7A, 500mA
Max On-State Resistance 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
Max Threshold Gate Voltage 2.5V @ 100µA, 2.5V @ 20µA
Max Gate Charge at Vgs 0.16nC @ 5V, 0.044nC @ 5V
Max Input Cap at Vds 16pF @ 50V, 7pF @ 50V
Maximum Power Handling -
Ambient Temp Range -40°C ~ 150°C (TJ)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 9-VFBGA
Vendor Package Type 9-BGA (1.35x1.35)

Description

Configured in a manner identified as 3 N-Channel (Half Bridge + Synchronous Bootstrap). Is capable of sustaining a continuous drain current (Id) of 1.7A, 500mA at 25°C. Supports a Vdss drain-to-source voltage rated at 100V. Ensures maximum 0.16nC @ 5V, 0.044nC @ 5V gate charge at Vgs for improved switching efficiency. Maintains 0.16nC @ 5V, 0.044nC @ 5V gate charge at Vgs for dependable MOSFET operation. The maximum input capacitance reaches 16pF @ 50V, 7pF @ 50V at Vds to protect the device. The input capacitance is specified at 16pF @ 50V, 7pF @ 50V at Vds for peak performance. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 150°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 9-VFBGA that offers mechanical and thermal protection. Type of package 9-BGA (1.35x1.35) that preserves the integrity of the device. Product status Last Time Buy concerning availability and lifecycle. Maximum Rds(on) at Id 0.16nC @ 5V, 0.044nC @ 5V for MOSFET performance. Maximum Rds(on) at Id and Vgs 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V for MOSFET specifications. Classification series for the product or component eGaN®. Supplier package type 9-BGA (1.35x1.35) for component selection. The primary technology platform GaNFET (Gallium Nitride) linked to the product category. Maximum Vgs(th) at Id 2.5V @ 100µA, 2.5V @ 20µA for MOSFET threshold specifications.