Attribute
Description
Manufacturer Part Number
APF30-30-13CB/A01
Manufacturer
Description
HEATSINK FORGED W/ADHESIVE TAPE
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 117

Quantity Unit Price Ext. Price
1000 ₹ 447.74000 ₹ 4,47,740.00
500 ₹ 464.61000 ₹ 2,32,305.00
300 ₹ 477.42000 ₹ 1,43,226.00
100 ₹ 506.16000 ₹ 50,616.00
50 ₹ 525.15000 ₹ 26,257.50
25 ₹ 544.86000 ₹ 13,621.50
10 ₹ 572.00000 ₹ 5,720.00
1 ₹ 646.14000 ₹ 646.14

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 612.32000 ₹ 612.32
10 ₹ 549.13000 ₹ 5,491.30
20 ₹ 521.54000 ₹ 10,430.80
50 ₹ 501.07000 ₹ 25,053.50
100 ₹ 485.05000 ₹ 48,505.00
200 ₹ 457.46000 ₹ 91,492.00
1000 ₹ 428.98000 ₹ 4,28,980.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line APF
IC Encapsulation Type Box
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design Assorted (BGA, LGA, CPU, ASIC...)
Mounting Technique Thermal Tape, Adhesive (Included)
Physical Shape Form Square, Fins
Linear Length Dimension 1.181" (30.00mm)
Horizontal Width Dimension 1.181" (30.00mm)
Circular Measurement -
Heat Sink Fin Elevation 0.500" (12.70mm)
Power at Temp Increase -
Thermal Resistance with Fan 2.50°C/W @ 200 LFM
Passive Cooling Resistance -
Construction Material Type Aluminum
Surface Material Treatment Black Anodized

Description

Fastened using a Thermal Tape, Adhesive (Included) method for dependable placement. Records the fin height at 0.500" (12.70mm). Overall length 1.181" (30.00mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Box for safeguarding or transporting components. Layout of the thermal management package Assorted (BGA, LGA, CPU, ASIC...) aimed at cooling. Product status Active concerning availability and lifecycle. Classification series for the product or component APF. Shape Square, Fins for the part or device. Thermal resistance with fan assistance 2.50°C/W @ 200 LFM for enhanced cooling efficiency. Type classification Top Mount for specifications. Horizontal width measurement 1.181" (30.00mm).