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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | WE-TGFG | |
| IC Encapsulation Type | Bag | |
| Availability Status | Active | |
| Intended Usage Scenario | Multi | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 45.00mm x 15.00mm | |
| Material Thickness Gauge | 0.0591" (1.500mm) | |
| Construction Material Type | Graphite | |
| Bonding Agent Type | Adhesive - Both Sides | |
| Support Layer Material | - | |
| Visual Hue | Black | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 400W/m-K |
Description
Applies Adhesive - Both Sides adhesive for strong and lasting bonding. Offered in a shade referred to as Black to enhance the system's aesthetics. Type of construction material Graphite for durability and efficiency. Shape outline 45.00mm x 15.00mm for device design and footprint. Type of housing Bag for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component WE-TGFG. Shape Rectangular for the part or device. Thermal conductivity coefficient 400W/m-K for effective heat transfer. Measurement of thickness 0.0591" (1.500mm) for material or component dimensions. Type classification Gap Filler Pad, Sheet for specifications. Application Multi for defined purpose or objective.
