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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | WE-TGF | |
| IC Encapsulation Type | Bag | |
| Availability Status | Active | |
| Intended Usage Scenario | Multi | |
| Device Type Classification | Gap Filler Pad, Sheet | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 400.00mm x 200.00mm | |
| Material Thickness Gauge | 0.0200" (0.508mm) | |
| Construction Material Type | Silicone, Ceramic Filled | |
| Bonding Agent Type | - | |
| Support Layer Material | Fiberglass | |
| Visual Hue | Blue | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | 3.0W/m-K |
Description
Constructed with Fiberglass backing/carrier materials for durability. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Offered in a shade referred to as Blue to enhance the system's aesthetics. Type of construction material Silicone, Ceramic Filled for durability and efficiency. Shape outline 400.00mm x 200.00mm for device design and footprint. Type of housing Bag for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component WE-TGF. Shape Rectangular for the part or device. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Thermal conductivity coefficient 3.0W/m-K for effective heat transfer. Measurement of thickness 0.0200" (0.508mm) for material or component dimensions. Type classification Gap Filler Pad, Sheet for specifications. Application Multi for defined purpose or objective. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications.
