Attribute
Description
Manufacturer Part Number
HF115AC-0.0055-AC-54
Manufacturer
Description
THERM PAD 19.05MMX12.7MM W/ADH
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 117

Quantity Unit Price Ext. Price
5000 ₹ 24.64000 ₹ 1,23,200.00
1000 ₹ 26.84000 ₹ 26,840.00
500 ₹ 27.84000 ₹ 13,920.00
300 ₹ 28.61000 ₹ 8,583.00
100 ₹ 30.32000 ₹ 3,032.00
50 ₹ 31.46000 ₹ 1,573.00
25 ₹ 32.64000 ₹ 816.00
10 ₹ 34.25000 ₹ 342.50
1 ₹ 38.35000 ₹ 38.35

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line Hi-Flow® 115-AC
IC Encapsulation Type Bulk
Availability Status Active
Intended Usage Scenario TO-220
Device Type Classification Pad, Sheet
Physical Shape Form Rectangular
Dimensional Outline Drawing 19.05mm x 12.70mm
Material Thickness Gauge 0.0055" (0.140mm)
Construction Material Type Phase Change Compound
Bonding Agent Type Adhesive - One Side
Support Layer Material Fiberglass
Visual Hue Gray
Material Heat Resistance 0.35°C/W
Heat Transfer Coefficient 0.8W/m-K

Description

Applies Adhesive - One Side adhesive for strong and lasting bonding. Constructed with Fiberglass backing/carrier materials for durability. Offered in a shade referred to as Gray to enhance the system's aesthetics. Type of construction material Phase Change Compound for durability and efficiency. Shape outline 19.05mm x 12.70mm for device design and footprint. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component Hi-Flow® 115-AC. Shape Rectangular for the part or device. Thermal conductivity coefficient 0.8W/m-K for effective heat transfer. Thermal resistivity measurement 0.35°C/W for material insulation effectiveness. Measurement of thickness 0.0055" (0.140mm) for material or component dimensions. Type classification Pad, Sheet for specifications. Application TO-220 for defined purpose or objective.