Attribute
Description
Manufacturer Part Number
TGF45-07870787-079
Manufacturer
Description
THERM PAD 199.9MMX199.9MM
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 108

Quantity Unit Price Ext. Price
20 ₹ 5,920.28000 ₹ 1,18,405.60

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line TGF45
IC Encapsulation Type Bulk
Availability Status Active
Intended Usage Scenario -
Device Type Classification Gap Filler Pad, Sheet
Physical Shape Form Square
Dimensional Outline Drawing 199.90mm x 199.90mm
Material Thickness Gauge 0.0790" (2.000mm)
Construction Material Type Aluminum Oxide filled Silicone
Bonding Agent Type -
Support Layer Material -
Visual Hue -
Material Heat Resistance -
Heat Transfer Coefficient -

Description

Type of construction material Aluminum Oxide filled Silicone for durability and efficiency. Shape outline 199.90mm x 199.90mm for device design and footprint. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Classification series for the product or component TGF45. Shape Square for the part or device. Measurement of thickness 0.0790" (2.000mm) for material or component dimensions. Type classification Gap Filler Pad, Sheet for specifications.