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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Q-Bridge | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Obsolete | |
| Intended Usage Scenario | Heat Transfer | |
| Device Type Classification | Thermal Bridge Jumper | |
| Physical Shape Form | Rectangular | |
| Dimensional Outline Drawing | 1.52mm x 0.76mm | |
| Material Thickness Gauge | 0.0025" (0.064mm) | |
| Construction Material Type | Beryllium Oxide | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | - | |
| Material Heat Resistance | 13°C/W, 20°C/W | |
| Heat Transfer Coefficient | 50W/m-K, 76W/m-K |
Description
Type of construction material Beryllium Oxide for durability and efficiency. Shape outline 1.52mm x 0.76mm for device design and footprint. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component Q-Bridge. Shape Rectangular for the part or device. Thermal conductivity coefficient 50W/m-K, 76W/m-K for effective heat transfer. Thermal resistivity measurement 13°C/W, 20°C/W for material insulation effectiveness. Measurement of thickness 0.0025" (0.064mm) for material or component dimensions. Type classification Thermal Bridge Jumper for specifications. Application Heat Transfer for defined purpose or objective.
