Attribute
Description
Manufacturer Part Number
4659
Manufacturer
Description
THERM PAD 30.15MM DIA
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Intended Usage Scenario | TO-36 | |
| Device Type Classification | Die-Cut Pad, Sheet | |
| Physical Shape Form | Round | |
| Dimensional Outline Drawing | 30.15mm Dia | |
| Material Thickness Gauge | 0.0030" (0.076mm) | |
| Construction Material Type | Mica | |
| Bonding Agent Type | - | |
| Support Layer Material | - | |
| Visual Hue | - | |
| Material Heat Resistance | - | |
| Heat Transfer Coefficient | - |
Description
Type of construction material Mica for durability and efficiency. Shape outline 30.15mm Dia for device design and footprint. Type of housing Bulk for safeguarding or transporting components. Product status Obsolete concerning availability and lifecycle. Shape Round for the part or device. Measurement of thickness 0.0030" (0.076mm) for material or component dimensions. Type classification Die-Cut Pad, Sheet for specifications. Application TO-36 for defined purpose or objective.
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