Attribute
Description
Manufacturer Part Number
TC1-200G
Manufacturer
Description
HEAT SINK COMPOUND - HIGH DENSIT
Manufacturer Lead Time
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Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 108

Quantity Unit Price Ext. Price
1 ₹ 4,445.55000 ₹ 4,445.55

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
1 ₹ 4,454.59000 ₹ 4,454.59

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Silicone Compound
Package Size Specs 200 gram Jar
Effective Temp Window -
Visual Hue White
Heat Transfer Coefficient 0.67W/m-K
Key Product Highlights -
Storage Duration Limit 60 Months
Cool Storage Temp Range 37°F ~ 77°F (3°C ~ 25°C)

Description

Offered in a shade referred to as White to enhance the system's aesthetics. Type of housing Bulk for safeguarding or transporting components. Product status Active concerning availability and lifecycle. Duration of product life 60 Months for durability. Details on package size 200 gram Jar for electrical or mechanical components. Measurement dimensions 200 gram Jar for component specifications. Temperature range 37°F ~ 77°F (3°C ~ 25°C) for storage or refrigeration to maintain material integrity. Thermal conductivity coefficient 0.67W/m-K for effective heat transfer. Type classification Silicone Compound for specifications.