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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | 423 | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Board Level, Extrusion | |
| Thermal Package Design | TO-3, DO-5, Stud Mount | |
| Mounting Technique | Press Fit | |
| Physical Shape Form | Rectangular, Fins | |
| Linear Length Dimension | 5.421" (139.70mm) | |
| Horizontal Width Dimension | 4.750" (120.65mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 2.625" (66.67mm) | |
| Power at Temp Increase | 50.0W @ 47°C | |
| Thermal Resistance with Fan | 0.50°C/W @ 250 LFM | |
| Passive Cooling Resistance | 0.96°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Fastened using a Press Fit method for dependable placement. Records the fin height at 2.625" (66.67mm). Overall length 5.421" (139.70mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package TO-3, DO-5, Stud Mount aimed at cooling. Power dissipation at increased temperature 50.0W @ 47°C for device longevity. Product status Active concerning availability and lifecycle. Classification series for the product or component 423. Shape Rectangular, Fins for the part or device. Thermal resistance with fan assistance 0.50°C/W @ 250 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 0.96°C/W for heat regulation. Type classification Board Level, Extrusion for specifications. Horizontal width measurement 4.750" (120.65mm).
