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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | BGA | |
| Mounting Technique | Clip | |
| Physical Shape Form | Cylindrical | |
| Linear Length Dimension | - | |
| Horizontal Width Dimension | - | |
| Circular Measurement | 1.375" (34.92mm) OD | |
| Heat Sink Fin Elevation | 0.571" (14.50mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | 5.26°C/W @ 200 LFM | |
| Passive Cooling Resistance | 12.30°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Fastened using a Clip method for dependable placement. Offers diameter noted at 1.375" (34.92mm) OD. Records the fin height at 0.571" (14.50mm). Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Tray for safeguarding or transporting components. Layout of the thermal management package BGA aimed at cooling. Product status Obsolete concerning availability and lifecycle. Shape Cylindrical for the part or device. Thermal resistance with fan assistance 5.26°C/W @ 200 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 12.30°C/W for heat regulation. Type classification Top Mount for specifications.
