Attribute
Description
Manufacturer Part Number
HSB02-101007
Manufacturer
Description
HEAT SINK, BGA, 10 X 10 X 7 MM
Manufacturer Lead Time
17 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 110

Quantity Unit Price Ext. Price
25704 ₹ 30.67000 ₹ 7,88,341.68
18360 ₹ 32.57000 ₹ 5,97,985.20
11016 ₹ 33.69000 ₹ 3,71,129.04
7344 ₹ 35.96000 ₹ 2,64,090.24
3672 ₹ 37.53000 ₹ 1,37,810.16
1000 ₹ 40.49000 ₹ 40,490.00
500 ₹ 42.06000 ₹ 21,030.00
50 ₹ 47.26000 ₹ 2,363.00

Stock:

Distributor: 115


Quantity Unit Price Ext. Price
25704 ₹ 30.67000 ₹ 7,88,341.68
18360 ₹ 32.57000 ₹ 5,97,985.20
11016 ₹ 33.69000 ₹ 3,71,129.04
7344 ₹ 35.96000 ₹ 2,64,090.24
3672 ₹ 37.53000 ₹ 1,37,810.16
1000 ₹ 40.49000 ₹ 40,490.00
500 ₹ 42.06000 ₹ 21,030.00
50 ₹ 47.26000 ₹ 2,363.00

Stock:

Distributor: 128


Quantity Unit Price Ext. Price
14688 ₹ 34.62000 ₹ 5,08,498.56
7344 ₹ 36.05000 ₹ 2,64,751.20
3672 ₹ 37.02000 ₹ 1,35,937.44
1000 ₹ 42.72000 ₹ 42,720.00
500 ₹ 43.61000 ₹ 21,805.00
200 ₹ 44.59000 ₹ 8,918.00
100 ₹ 47.70000 ₹ 4,770.00
50 ₹ 50.46000 ₹ 2,523.00
10 ₹ 54.91000 ₹ 549.10
5 ₹ 61.23000 ₹ 306.15

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line HSB
IC Encapsulation Type Box
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design BGA
Mounting Technique Adhesive (Not Included)
Physical Shape Form Square, Pin Fins
Linear Length Dimension 0.394" (10.00mm)
Horizontal Width Dimension 0.394" (10.00mm)
Circular Measurement -
Heat Sink Fin Elevation 0.275" (7.00mm)
Power at Temp Increase 2.0W @ 75°C
Thermal Resistance with Fan 16.50°C/W @ 200 LFM
Passive Cooling Resistance 37.90°C/W
Construction Material Type Aluminum Alloy
Surface Material Treatment Black Anodized

Description

Fastened using a Adhesive (Not Included) method for dependable placement. Records the fin height at 0.275" (7.00mm). Overall length 0.394" (10.00mm) for size indication. Type of construction material Aluminum Alloy for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Box for safeguarding or transporting components. Layout of the thermal management package BGA aimed at cooling. Power dissipation at increased temperature 2.0W @ 75°C for device longevity. Product status Active concerning availability and lifecycle. Classification series for the product or component HSB. Shape Square, Pin Fins for the part or device. Thermal resistance with fan assistance 16.50°C/W @ 200 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 37.90°C/W for heat regulation. Type classification Top Mount for specifications. Horizontal width measurement 0.394" (10.00mm).