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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HSS | |
| IC Encapsulation Type | Bag | |
| Availability Status | Obsolete | |
| Device Type Classification | Board Level, Vertical | |
| Thermal Package Design | TO-220 | |
| Mounting Technique | PC Pin | |
| Physical Shape Form | Rectangular, Fins | |
| Linear Length Dimension | 0.500" (12.70mm) | |
| Horizontal Width Dimension | 0.500" (12.70mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.748" (19.00mm) | |
| Power at Temp Increase | 3.2W @ 75°C | |
| Thermal Resistance with Fan | 6.40°C/W @ 200 LFM | |
| Passive Cooling Resistance | 23.81°C/W | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | Black Anodized |
Description
Fastened using a PC Pin method for dependable placement. Records the fin height at 0.748" (19.00mm). Overall length 0.500" (12.70mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Bag for safeguarding or transporting components. Layout of the thermal management package TO-220 aimed at cooling. Power dissipation at increased temperature 3.2W @ 75°C for device longevity. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component HSS. Shape Rectangular, Fins for the part or device. Thermal resistance with fan assistance 6.40°C/W @ 200 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 23.81°C/W for heat regulation. Type classification Board Level, Vertical for specifications. Horizontal width measurement 0.500" (12.70mm).
