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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | BG | |
| IC Encapsulation Type | Box | |
| Availability Status | Obsolete | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | BGA, CPU, GPU | |
| Mounting Technique | Thermal Tape, Adhesive (Included) | |
| Physical Shape Form | Square, Angled Fins | |
| Linear Length Dimension | 0.591" (15.00mm) | |
| Horizontal Width Dimension | 0.591" (15.00mm) | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | 0.295" (7.50mm) | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | 18.00°C/W | |
| Construction Material Type | Aluminum Alloy | |
| Surface Material Treatment | Black Anodized |
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