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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Top Mount | |
| Thermal Package Design | Raspberry Pi 3B, 3B+, 4B | |
| Mounting Technique | Thermal Tape, Adhesive (Included) | |
| Physical Shape Form | Rectangular, Fins; Square, Fins | |
| Linear Length Dimension | - | |
| Horizontal Width Dimension | - | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | - | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | - | |
| Construction Material Type | Aluminum | |
| Surface Material Treatment | - |
Description
Fastened using a Thermal Tape, Adhesive (Included) method for dependable placement. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Type of construction material Aluminum for durability and efficiency. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package Raspberry Pi 3B, 3B+, 4B aimed at cooling. Product status Active concerning availability and lifecycle. Shape Rectangular, Fins; Square, Fins for the part or device. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Type classification Top Mount for specifications. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications.
