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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | ICE Tower | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Device Type Classification | Board Level | |
| Thermal Package Design | Raspberry Pi 3B, 3B+, 4B | |
| Mounting Technique | Bolt On and Thermal Tape, Adhesive (Included) | |
| Physical Shape Form | Rectangular | |
| Linear Length Dimension | - | |
| Horizontal Width Dimension | - | |
| Circular Measurement | - | |
| Heat Sink Fin Elevation | - | |
| Power at Temp Increase | - | |
| Thermal Resistance with Fan | - | |
| Passive Cooling Resistance | - | |
| Construction Material Type | - | |
| Surface Material Treatment | - |
Description
Fastened using a Bolt On and Thermal Tape, Adhesive (Included) method for dependable placement. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package Raspberry Pi 3B, 3B+, 4B aimed at cooling. Product status Active concerning availability and lifecycle. Classification series for the product or component ICE Tower. Shape Rectangular for the part or device. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Type classification Board Level for specifications. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications.
