Attribute
Description
Manufacturer Part Number
FIT0367
Manufacturer
Description
RASPBERRY PI COPPER HEATSINK
Manufacturer Lead Time
4 weeks

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Product Attributes

Type Description
Category
Import Duty Classification Tariff may apply if shipping to the United States
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design Raspberry Pi
Mounting Technique Thermal Tape, Adhesive (Included)
Physical Shape Form Rectangular
Linear Length Dimension 0.520" (13.20mm)
Horizontal Width Dimension 0.476" (12.10mm)
Circular Measurement -
Heat Sink Fin Elevation -
Power at Temp Increase -
Thermal Resistance with Fan -
Passive Cooling Resistance -
Construction Material Type Copper
Surface Material Treatment -

Description

Fastened using a Thermal Tape, Adhesive (Included) method for dependable placement. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Overall length 0.520" (13.20mm) for size indication. Type of construction material Copper for durability and efficiency. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package Raspberry Pi aimed at cooling. Product status Active concerning availability and lifecycle. Shape Rectangular for the part or device. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Type classification Top Mount for specifications. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Horizontal width measurement 0.476" (12.10mm).