Attribute
Description
Manufacturer Part Number
PF527G
Manufacturer
Description
BOARD LEVEL HEAT SINK
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 158

Quantity Unit Price Ext. Price
250 ₹ 1,806.97000 ₹ 4,51,742.50

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Device Type Classification Top Mount
Thermal Package Design TO-3
Mounting Technique Bolt On
Physical Shape Form Rhombus
Linear Length Dimension 1.606" (40.80mm)
Horizontal Width Dimension 1.060" (26.92mm)
Circular Measurement -
Heat Sink Fin Elevation 0.984" (25.00mm)
Power at Temp Increase 6.0W @ 30°C
Thermal Resistance with Fan 5.00°C/W @ 400 LFM
Passive Cooling Resistance 7.40°C/W
Construction Material Type Aluminum
Surface Material Treatment Black Anodized

Description

Fastened using a Bolt On method for dependable placement. Records the fin height at 0.984" (25.00mm). Overall length 1.606" (40.80mm) for size indication. Type of construction material Aluminum for durability and efficiency. Coating Black Anodized for safeguarding and aesthetic enhancement. Type of housing Bulk for safeguarding or transporting components. Layout of the thermal management package TO-3 aimed at cooling. Power dissipation at increased temperature 6.0W @ 30°C for device longevity. Product status Active concerning availability and lifecycle. Shape Rhombus for the part or device. Thermal resistance with fan assistance 5.00°C/W @ 400 LFM for enhanced cooling efficiency. Thermal resistance in natural airflow 7.40°C/W for heat regulation. Type classification Top Mount for specifications. Horizontal width measurement 1.060" (26.92mm).